Memory card with adapter

ABSTRACT

The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.

This application is a continuation-in-part application of the followingthree application: (1) U.S. patent application Ser. No. 10/621,882,entitled “Peripheral Card with Hidden Test Pins,” filed Jul. 17, 2003 byHem P. Takiar; (2) U.S. Design application Ser. No. 29/186,546 entitled“Memory Card,” filed Jul. 17, 2003 by Hem P. Takiar; and (3) U.S. Designapplication Ser. No. 29/194,064 entitled “Memory Card,” filed Nov. 19,2003 by Takiar et al. All three of these applications are incorporatedherein by reference.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Application is also related to the following additional UnitedStates patent applications, both of which are incorporated herein byreference in their entirety:

-   -   “Method For Efficiently Producing Removable Peripheral Cards,”        application Ser. No. 10/602,373, filed Jun. 23, 2003, Hem P.        Takiar; and    -   “Memory Card With Raised Portion,” application Ser. No.        10/782,969, filed Feb. 20, 2004, Hem P. Takiar.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is directed to technology for peripheral cards.

2. Description of the Related Art

Memory cards are relatively small removable cards that provide datastorage. In most cases, but not required in all cases, the memory cardis integrated circuit based. These memory cards plug into or arereceived by ports or connectors on electronic devices, includingcomputing devices, cameras, mobile telephones, PDAs and other devices.One example of a memory card uses non-volatile memory. ElectricalErasable Programmable Read Only Memory (EEPROM) and flash memory areamong the most popular non-volatile semiconductor memories. Someexamples of memory cards includes CompactFlash™, MMC™, Smart Media,Secure Digital™, MiniSD and the Memory Stick.

A flash memory card is a memory card that has one or more arrays offlash memory cells. Some flash memory cards also include bit linedecoders, word line decoders, a state machine, a controller and othercircuitry. In many cases the controller will be implemented in a firstsemiconductor die, while the array of flash memory cells, bit linedecoders, word line decoders, and state machine are implemented in asecond semiconductor die. Over time, flash memory arrays have increaseddensity by shrinking the size of an individual memory cell and byimplementing greater numbers of memory cells in the array.

To maintain product reliability and customer satisfaction, manufacturersof memory cards will test the memory cards during the manufacturingprocess in order to determine if there are any manufacturing defects. Inmany cases, the user I/O pins on the memory card connect to thecontroller. However, a test performed during manufacturing typicallyseeks to directly access the memory array (bypassing the controller) inorder to test each cell in the memory array. Additionally, more pinswill allow for more efficient and complete testing of the relevantcomponents of the memory card. Thus, many memory cards will include testpins, in addition to the user I/O pins. To protect the memory card fromelectrostatic discharge relative to the test pins and to protect thedata on the card from being wrongfully accessed via the test pins, thetest pins should not be exposed to the user of the memory card after themanufacturing process.

One example of a memory card is described in U.S. Pat. No. 6,410,355(the '355 patent”), incorporated herein by reference in its entirety. Inthe '355 patent, a memory card using flash memory is manufactured with aset of test pins at one edge of the memory card. After the memory cardis tested, the test pins are cut off of the memory card and the memorycard is then packaged. While the device of the '355 patent has workedwell, there is a need for an improvement. First, the test pins that arecut off use real estate on the circuit board. There is a trend toincrease density on circuit boards; therefore, it would be advantageousto not use a portion of the circuit board for components that will notship to customers. Second, if the memory card fails in the field, thereare no test pins to test the device in order to determine why the memorycard failed. Such tests following device failure allow a manufacturer ofmemory cards to improve device reliability and the manufacturingprocess.

Another example of a memory card using flash memory is the recentlyreleased Mini-SD Card. In one commercial version of the Mini-SD Card,the memory array is mounted on the top of the circuit board and thecontroller is mounted on the memory array. User I/O pins and test pinsare formed on the bottom of the circuit board. After the memory card istested, the circuit board (with the controller, memory array and othercomponents) are enclosed by attaching a top lid to a bottom lid. Boththe bottom lid and the top lid are made of a hard plastic, and aremanufactured from a mold prior to enclosing the circuit board. After thetop and bottom lids are made, the top lid is ultra-sonically welded tothe bottom lid to enclose the circuit board (with the controller, memoryarray and other components). The bottom lid has an opening for the userI/O pins. The bottom lid does not have an opening for the test pins;therefore, the test pins are not exposed to users. There will be a smallair gap between the bottom lid and the bottom of the circuit board Whilethis design works well, the top and bottom lids are relatively expensiveto manufacture. Additionally, the lids are relatively bulky which limitshow small the memory cards can be manufactured. The trend in theindustry to further decrease the size of memory cards.

As the memory cards are made smaller, they become increasingly difficultto handle by a human. Additionally, as the memory cards are madesmaller, small variations in the packaging will have a largerproportional effect on the card. For example, due to the size of thememory card in relation to a human hand and due to variations inmanufacturing, very small memory cards may be difficult to insert and/orremove into ports or connectors on electronic devices.

SUMMARY OF THE INVENTION

The present invention, roughly described, pertains to a small memorycard that includes features which allow the memory card to be moreeasily handled by a user.

One embodiment of the present invention includes a memory card with achamfer. In some examples, the memory card is rectangular, and a diamondsaw is used to cut a flat surface from the edge of the rectangularmemory card. In one implementation, the memory card is made by addingdevices to a circuit board, performing an encapsulation process ormolding process (e.g., injection mold or transfer mold) to cover thedevices and then cutting a flat surface from the edge of the rectangularmemory card.

In another embodiment, the memory card includes a raised portion thatallows the memory card to be more easily grabbed by a human hand (ormechanical device) and also provides additional room to store passivedevices such as capacitors and/or resistors.

There are various ports or connectors on electronic devices that canreceive the memory cards described herein. One example is a push-pushconnector. The memory card is inserted into the connector using a firstpush against the memory card. Pushing the memory card a second timereleases the memory card from the connector. In one embodiment, when thememory card is pushed the second time, it is released from the connectorsuch that the raised portion of the memory card is protruding from theconnector or host device. In this manner, the user can grab the memorycard by the raised portion to fully remove it from the connector. Inanother embodiment, the raised portion will protrude from the connectorafter the first push and prior to the second push (i.e., while thememory card is connected) to make it easier from the user to handle thememory card.

Because different electronic devices use different types of memorycards, an adaptor is provided that allows the memory cards disclosedherein to be used in ports or connectors on electronic devices that aremeant for other types of memory cards (e.g. CompactFlash™, MMC™, SmartMedia, Secure Digital™, MiniSD and the Memory Stick.). In someimplementations, the raised portion of the memory card protrudes fromthe adaptor or can otherwise be accessed by a user when the card isproperly inserted in the adaptor.

While in the adaptor, the memory card can be inserted into a host deviceand data can be written to and read form the memory card. Similarly, thememory card can be inserted into a host device and data can be writtento and read form the memory card when the memory card is not in theadaptor. As described herein, the memory card can be manufactured andused without a bottom lid or a top lid. Such a memory card can then beinserted into an adaptor, where the adaptor includes or serves as a toplid and/or bottom lid. As described above, the memory card can be usedwhile in the adaptor that includes or serves as a top lid and/or bottomlid.

The present invention can be applied to the manufacture of memory cards,including flash memory cards. The technology disclosed herein can alsobe applied to other memory cards or other peripheral cards. For example,the present invention can be used with removable peripheral cards thatinclude wireless communication devices, GPS devices, cellular devices,network interfaces, modems, disk storage systems, and other devices. Thepresent invention is not limited to any one type of peripheral card.

These and other objects and advantages of the present invention willappear more clearly from the following description in which thepreferred embodiment of the invention has been set forth in conjunctionwith the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of the bottom of a memory card according toa one embodiment of the present invention.

FIG. 2 is a perspective view of the top of the memory card according tothe one embodiment of the present invention.

FIG. 3 is a side view of the memory card according to the one embodimentof the present invention.

FIG. 4 is a perspective view of the top of a memory card according to aone embodiment of the present invention.

FIG. 5 is a perspective view of the top of a memory card according to aone embodiment of the present invention.

FIG. 6A is a perspective view of the top of a memory card according to aone embodiment of the present invention.

FIG. 6B is a perspective view of the bottom of the memory card accordingto the one embodiment of the present invention.

FIG. 7A is a perspective view of the top of a memory card according to aone embodiment of the present invention.

FIG. 7B is a perspective view of the bottom of the memory card accordingto the one embodiment of the present invention.

FIG. 7C is a side view of the memory card according to the oneembodiment of the present invention.

FIG. 7D is a side view of the memory card according to the oneembodiment of the present invention.

FIG. 8 is a perspective view of the top of a memory card according to afifth embodiment of the present invention.

FIG. 9 is a perspective view of the bottom of the memory card accordingto the fifth embodiment of the present invention.

FIG. 10 is a side view of the memory card according to the fifthembodiment of the present invention.

FIG. 11 is a top view of a circuit board used for various embodiments ofthe present invention.

FIG. 12 is a bottom view of the circuit board used for variousembodiments of the present invention.

FIG. 13 is a cross section of an exemplar circuit board.

FIG. 14 is a cross sectional view of one embodiment of a circuit boardand various components on the circuit board during the manufacturingprocess.

FIG. 15 is a cross sectional view of one embodiment of a circuit boardand various components encapsulated on the circuit board during themanufacturing process.

FIG. 16 is a cross sectional view of one embodiment of a circuit boardand various components on the circuit board, with a conformal contactcoating applied to a surface of the circuit board.

FIG. 16A is a cross sectional view of one embodiment of a circuit boardand various components on the circuit board after cutting as chamfer.

FIG. 16B is a close-up a chamfer cut into a memory card.

FIG. 17 is a flow chart describing one embodiment of a process formanufacturing a memory card according to the present invention.

FIG. 18 is a plan view of a strip of memory cards prior to singulation.

FIG. 19 is a perspective view of the top of the memory card according toan additional embodiment of the present invention.

FIG. 20 is a perspective view of the bottom of the memory card accordingto the embodiment of FIG. 19.

FIG. 21 is a perspective view of the top of the memory card according toan additional embodiment of the present invention.

FIG. 22 is a perspective view of the bottom of the memory card accordingto the embodiment of FIG. 21.

FIG. 23 is a flow chart describing one embodiment of a process for usinga memory card with a push-push latch of a host device.

FIGS. 24-27 are block diagrams illustrating a memory card in variousengaging positions with a push-push latch of a host device.

FIGS. 28A-D show a memory card and an adapter 900.

FIG. 29 is a flow chart describing one embodiment of a process for usinga memory card with an adapter.

DETAILED DESCRIPTION

FIGS. 1-10 depict various embodiments of a memory card. For example,FIG. 1 is a perspective view of the bottom of a memory card according toa first embodiment of the present invention. FIG. 2 is a perspectiveview of the top of the memory card according to the first embodiment ofthe present invention. FIG. 3 is a side view of the memory cardaccording to the first embodiment of the present invention. The memorycard of FIGS. 1-3 includes a top surface 10, a bottom surface, a frontsurface 12, a back surface 14 and two side surfaces. One of the sidesurfaces has an angle portion 16. Top surface 10 has a raised portion 18adjacent to back surface 14. Raised portion 18 allows the memory card tobe more easily grabbed by a human hand (or mechanical device) and alsoprovides additional room to store passive devices such as capacitorsand/or resistors. Note that raised portion 18 of FIG. 1 has a curvedprofile. The bottom surface includes a first portion 22 and a secondportion 24. Second portion 24 is raised from first portion 22. Firstportion 22 includes a set of user I/O pins 26 and corresponds to abottom surface of a circuit board, as discussed below. Additionally,note that the bottom of front surface 12 includes a chamfer 40, as canbe seen in FIG. 3. More information about chamfer 40 will be providedbelow.

In one implementation, the memory card is 12 mm wide and 15 mm long. Theangled portion is at a forty five degree angle. The thickness of thememory card is 0.9 mm at second portion 24, 1.0 mm at raised portion 18and 0.8 mm at first portion 22. In another embodiment, the thickness ofthe memory card is 0.8 mm at second portion 24, 1.0 mm at raised portion18 and 0.7 mm at first portion 22. In other embodiments, otherdimensions can also be used.

In one embodiment, a label will be placed on the top surface. This labelcan be a sticker or can be ink which is pad printed.

FIG. 4 is a perspective view of the top of a memory card according to asecond embodiment of the present invention. The second embodimentincludes a raised portion 18 a that has a straight profile. FIG. 5 is aperspective view of the top of a memory card according to a thirdembodiment of the present invention which does not include a raisedportion 18.

FIG. 6A is a perspective view of the top of a memory card according to afourth embodiment of the present invention. FIG. 6B is a perspectiveview of the bottom of the memory card according to the fourth embodimentof the present invention. The fourth embodiment includes notch 30. Thenotch is used to secure the card in position when connected to a hostdevice.

FIG. 7A is a perspective view of the top of a memory card according to afifth embodiment of the present invention. FIG. 7B is a perspective viewof the bottom of the memory card according to the fifth embodiment ofthe present invention. FIG. 7C is a side view of the memory cardaccording to the fifth embodiment of the present invention. FIG. 7D isan additional side view of the memory card according to the fifthembodiment of the present invention. Note that the fifth embodimentincludes the notch 30, raised portion 18 and chamfer 40 (see FIGS. 7Cand 7D). The bottom surface of the memory card includes a first portion22A and a second portion 24A, where second portion 24A is raised fromfirst portion 22A by 0.1-0.2 mm.

FIG. 7D shows other dimensions in millimeters. For example, the lengthof the memory card is 15 mm, the width at raised portion is 1.0mm+/−0.1, the width at first portion 22A is 0.7 mm+/−0.1 and the widthof chamfer 40 is. 0.3 mm+/−0.1.

FIG. 8 is a perspective view of the top of the memory card according toa sixth embodiment of the present invention. FIG. 9 is a perspectiveview of the bottom of the memory card according to the sixth embodimentof the present invention. FIG. 10 is a side view of the memory cardaccording to the sixth embodiment of the present invention. The sixthembodiment of the present invention implements a different orientationthan the other embodiments described above. For example, the top surfaceof the memory card in the sixth embodiment includes a raised portion 54adjacent back edge 52, which runs along the length as opposed to thewidth of the memory card. The memory card of the sixth embodimentincludes a front surface 50 that also runs along the length of thememory card. The bottom surface of the memory card includes a firstportion 54 and second portion 56. First portion 54 includes a set ofuser I/O pins 58 and corresponds to a bottom surface of a circuit board,as discussed below. Second portion 56 is raised from first portion 54.

FIG. 11 provides a top view of a circuit board used for variousembodiments of the present invention. FIG. 11 shows circuit board 200.Mounted on circuit board 200 are first die 202 and second die 204. Inone embodiment, die 202 includes a flash memory array with associatedcircuitry and die 204 includes a controller. In some embodiments, thememory card may include more than one memory array. In embodiments thatinclude a peripheral card other than a memory card, the dies can becomponents other than or in addition to memory arrays and controllers.Note that die 202 includes contacts 212 (e.g. die bond pads) which areused to connect die 202 to other components. Similarly, die 204 includescontacts 214 (e.g. die bond pads) to connect die 204 to othercomponents. Circuit board 200 also includes passive components 220,which could include capacitors and/or resistors. Circuit board 200includes a number of conductive traces (not shown) which interconnectthe devices mounted on the circuit board. Connecting regions (notdepicted) are provided on the circuit board so that the leads from diescan be connected to the circuit board by conventional wire bonding. Inother embodiments, other means different than wire bonding can be usedto connect the dies to the circuit board.

FIG. 12 shows the bottom of circuit board 200. In one embodiment, thebottom of circuit board 200 includes user I/O pins 230 and test pins232. FIG. 12 depicts eight user I/O pins 230 and sixteen test pins 232;however, different numbers of pins can also be used. The test pins 232can include data pins and/or power pins. The test pins are used to testone or more of the components of the memory card. For example, the testpins can be used to test each of the cells of the memory array. The userI/O pins 230 are used by a host device connected to the memory card inorder to communicate with the memory card. For example, the user I/Opins 230 can be used to communicate with the controller on die 204. Notethat in order to have a small package, one embodiment of the presentinvention includes mounting the integrated circuits on a first surfaceof the circuit board (e.g. the top surface) and forming the terminals(user I/O pins and test pins) on a conductive layer on another surfaceof the circuit board (e.g. the bottom surface).

FIG. 13 shows a cross sectional view of circuit board 200. FIG. 13 showsfive layers 260, 262, 264, 266, and 268. Other embodiments have lessthan or more than five layers. Layer 260, the middle layer, is aninsulating core layer. Layers 262 and 264 are routing layers, whichinclude conductive metal traces. Layers 266 and 268 include soldermasks. Connections between layers (such as layers 262 and 264) can bemade by conductive vias. In one embodiment, the circuit board is aprinted circuit board. In another embodiment, the circuit board is alead frame. Other types of circuit boards may also be used within thespirit of the present invention.

FIGS. 14-16A graphically depict the manufacturing process for creatingthe memory card according one embodiment of the present invention. FIG.14 is a side view of the memory card during the manufacturing process,prior to encapsulation. FIG. 14 depicts circuit board 200. Mounted oncircuit board 200 is die 202. Mounted on die 202 is die 204. FIG. 14shows die 202 and die 204 wire bonded to circuit board 200. FIG. 14 alsoshows passive devices 220, which can be capacitors and/or resistors. Inone embodiment, die 202 is mounted on circuit board 200 using anadhesive material. The adhesive material may be an epoxy adhesive, softsolder or any other adhesive material for mounting a die to a substrate.Die 204 is mounted on die 202 by way of an adhesive material applied tothe top surface of die 202 and the bottom surface of die 204. Moreinformation about stacking two dies on top of each other can be found inU.S. Pat. No. 5,502,289, incorporated herein by reference in itsentirety. In one embodiment, the passive devices are surface mountedusing solder.

FIG. 15 shows the memory card of FIG. 14 after encapsulation. That is,using an injection mold process or a transfer mold process, moldingmaterial 280 is used to encapsulate the components of the memory card.Note that the encapsulation covers the side surfaces, front surface,back surface, and top surface of circuit board 200. The encapsulationalso covers all the components mounted on the top surface of circuitboard 200. The bottom surface of circuit board 200, which includes userI/O pins 230 and test pins 232, is not covered by the encapsulation. Insome embodiment, encapsulation can cover a subset of that describedabove.

Subsequent to encapsulation, a conformal contact coating 290 is appliedto a portion of the bottom surface of circuit board 200 in order tocover test pins 232. The conformal contact coating does not cover userI/O pins 230. FIG. 16 depicts the memory card after the conformalcontact coating 290 has been applied. For example, the conformal contactcoating 290 is applied to portion 24 (see FIG. 1) of the bottom surfaceof the memory card, but not to portion 22 of the memory card. Theconformal contact coating protects the test pins from electrostaticdischarge and protects the data in the memory from unwanted access viathe test pins by blocking the test pins. The coating is a conformalcontact coating because it conforms to the shape of the surface it isbeing applied to and it is in direct contact to that surface. Some othermemory cards may use a lid to cover the bottom of the circuit board.That lid is not in contact with the bottom surface of the circuit board.Rather, an air gap will exist between the bottom lid and circuit board.Additionally, because the lid is prefabricated it will not conform tothe shape of the bottom surface of the bottom of the circuit board.

In one embodiment, the application of the conformal contact coatingincludes applying a liquid directly to the bottom surface of the circuitboard. The coating then dries to a solid. In another embodiment, thecoating is applied as a film directly to the bottom surface of thecircuit board. Examples of coatings include photoresist, solder mask,epoxy, thermoplastic, and polyimide. One specific example of a suitablecoating is the PSR-400 Solder Mask from Taiyo America, Inc.,www.taiyo-america.com. Examples of a film include mylar with an adhesiveor polyimide with an adhesive. An example of a suitable polyimide isKapton, by DuPont. One example of how to apply a liquid coating is touse a screen printing process.

FIG. 16A depicts the memory card after chamfer 40 has been cut. In oneembodiment, chamfer 40 can be cut after encapsulation with a mechanicalcutting process. For example, a diamond saw having a blade with an anglecan be used. Other cutting devices can also be used.

FIG. 16B shows a close-up of chamfer 40. In one embodiment, the chamferis cut through molding material 280 and circuit board 200. In otherembodiments, chamfer 40 is only cut through molding material 280, onlycut through circuit board 200 or cut through other materials. In oneimplementation, chamfer 40 is cut at a 60 degree angle relative to theedge of the memory card. In other embodiment, other angles can be cut.

In some embodiments, chamfer is cut through the bottom surface and frontedge of the outer surface of the memory card, thereby, removing a cornerof the memory card.

Chamfer 40 narrows the front edge of the memory card so that the memorycard is easier to insert into a port/slot/connector. Such a feature isuseful since the memory card is so small.

FIG. 17 is a flowchart depicting one embodiment of a process formanufacturing a memory card according to the present invention. In step400, vias are drilled in the circuit board. In step 402, a top patternis applied to circuit board 200 to add the conductive traces andconnection regions discussed above. In step 404, a bottom pattern isapplied to the bottom surface of circuit board 200 to add the user I/Opins 230, 232 test pins and conductive traces. In step 406, solder maskis added to the top surface of circuit board 200. In step 408, thesolder mask is added to the bottom surface of circuit board 200. In step410, first die 202 is mounted to circuit board 200. In step 412, seconddie 204 is mounted to circuit board 200. In step 414, passive devices220 are mounted to circuit board 200. In step 416, wire bonds are addedto connect dies 202 and 204 to circuit board 200. In one embodiment,protective coatings are applied to the wire bonds and/or the dies. Instep 418, circuit board 200 and the components mounted on circuit board200 are subject to a transfer mold process so that the circuit board andits components are encapsulated, as described above. However, theencapsulation process of step 418 does not cover the bottom surface ofcircuit board 200.

In one embodiment, a memory card is manufactured as a unitary structure.In that case, step 420 is skipped and the process of FIG. 17 proceeds tostep 422. However, in other embodiments the memory cards are produced abatch at a time. That is, a strip of memory cards are produced at onetime and then a singulation process is performed to cut the strip intoindividualized memory cards. In the case where the memory cards areproduced at a batch at a time, step 420 includes cutting the strip toseparate the various memory cards. Step 420 is referred to assingulation.

In step 422, the memory cards are tested. In step 424, the test pins arecovered, as described above, by applying the conformal contact coatingto a portion of the bottom surface of the circuit board 200 (e.g. bottomportion 24 of FIG. 1). In step 426, chamfer 40 is cut in the memorycards.

Step 422 includes testing the memory cards. During the manufacturingprocess, the manufacturer may perform a burn-in test of the memory cardto verify that each of the memory cells in the memory array arefunctional. The manufacturer may then program the memory card to avoidbad memory cells. For example, the memory array may include a portion ofmemory that stores addresses for bad memory cells and pointers toreplacement memory cells. In some embodiments, the other components ofthe memory card may also be tested. Note that FIG. 17 shows that thedevices are tested and receive the conformal contact coating aftersingulation. In another embodiment, step 420 is performed after to step422; therefore, the various devices are tested and receive the conformalcontact coating prior to singulation.

FIG. 18 is a plan view of a strip of memory cards prior to singulation.FIG. 18 shows strip 500. On top of strip 500 are various instances ofthe memory cards. Each memory card is depicted in dashed lines. In oneembodiment, strip 500 includes 100 memory cards (5 wide, 20 long). Notethat other numbers of memory cards can also be manufactured on a strip.Strip 500 is manufactured by performing steps 400-418 simultaneously foreach of the memory cards on the strip. That is, the steps are performedon the strip as a whole. Step 420 is performed by cutting the strip intoseparate devices. According to one aspect of the present invention, thememory cards are not fully rectangular in their shape. Therefore, thesingulation of the strip into individual memory cards includes nonlinear(e.g. curvilinear) sawings. Such sawing can be performed efficientlywith a very thin saw with high precision and detail, such that thesawing action is very fine. Examples of the sawing devices include, forexample, a water jet cutting device, a laser cutting apparatus, a waterguided laser, a dry media cutting device, and a diamond coated wire.Water jet cutting may be the preferred cutting method given its smallcutting width (e.g. 50 microns), its ability to shape small features andits rapid cutting rate.

If the memory card fails after it is in use, then the failed memory cardcan be debugged by removing the conformal contact coating and using thetest pins to test the memory card.

FIG. 19 is a perspective view of the top of the memory card according toan additional embodiment of the present invention. FIG. 20 is aperspective view of the bottom of the memory card according to theembodiment of FIG. 19. Card 600 depicted in FIGS. 19 and 20 includesrounded notches 602 and 604, raised portion 606 and angled portion 608.Bottom surface 612 includes pins 620 and portion 622. Portion 622 israised from surface 612 and covers the test pins as described herein.

FIG. 21 is a perspective view of the top of the memory card according toan additional embodiment of the present invention. FIG. 22 is aperspective view of the bottom of the memory card according to theembodiment of FIG. 21. Card 700 depicted in FIGS. 21 and 22 includesnotch 702, raised portion 706 and angled portion 708. Bottom surface 712includes pins 720 and portion 722. Portion 722 is raised from surface712 and covers the test pins as described herein.

The description above specifically discusses memory cards. One set ofembodiments of the present invention specifically pertain to flashmemory cards, which include one or more memory arrays that utilize flashmemory technology. The embodiments explained above pertaining to memorycards are for example purposes and are not mean to limit the invention.The technology disclosed herein can also be applied to other peripheralcards that connect to a computing device and are controlled or operatedwith the computing device. One example of a removable peripheral card isa PCMCIA card. Examples of applications, in addition to memory systems,that can be implemented on peripheral cards include wirelesscommunication devices, GPS devices, cellular devices, networkinterfaces, modems, disk storage systems, etc. The present invention isnot limited to any one type of peripheral card and is meant to be usedwith many different types of peripheral cards.

FIG. 26 is a flow chart describing a process for using a memory card (asdescribed above) with a push-push latch of a host device A push-pushlatch is a latch wherein latching and unlatching is accomplished by aninward push by the user into the latch housing. Push-push latched areknown in the art. For example, U.S. Pat. No. 6,719,337 (incorporatedherein by reference in its entirety) discloses a push-push latch.Additionally, the Sony Clie PEG-SJ33 handheld computing device from SonyCorporation uses a push-push latch with a Memory Stick.

In step 780 of FIG. 23, a memory card (any of the embodiments describedabove) is inserted into a slot in the host device (e.g. computer,handheld, cellular telephone, game, music device, etc.). In step 782,the user (e.g. a human, a robot, other machine, etc.) pushes the memorycard into a full insertion position with respect to the push-push latch.For example, FIG. 24 shows memory card 800 pushed in a full insertionposition with respect to the push-push latch 804 of host device 802. Instep 784, the user stops pushing the memory card (the user releases thememory card), so that the memory card is moved to its latched position.That is, the memory card is latched to the push-push latch. For example,FIG. 25 shows memory card 800 in a latched position with respect to thepush-push latch 804 of host device 802. In the latched position of FIG.25, memory card is slightly further out of the host then in FIG. 24.That is push-push latch 804 is holding memory card 800. Note that aportion of memory card 800 and push-push latch 804 are shown with dashedlines, indicating that they are inside host device 802. At this point, auser can write data to and read data from memory card 800 using hostdevice 802. In one embodiment, a portion of memory card 800, includingraised portion 18, is protruding out from host device 802.

If the user wants to remove memory card 800 from host device 802, theuser will push the memory card to its full insertion position in step786 (see FIG. 24). In step 788, the user stops pushing the memory card,so that the memory card is moved to its released position with respectto the push-push latch 804. For example, FIG. 26 shows memory card 800in a released position with respect to the push-push latch 804 of hostdevice 802. Note that a portion of memory card 800, including raisedportion 18, is protruding out from host device 802. In step 790, theuser engages the memory card by the raised portion 18 and pulls thememory card from host device 802. In an alternative embodiment depictedin FIG. 27, memory card 800 is fully inserted into host device 802 whenmemory card is in the latched position after step 784.

Note that FIGS. 24-27 depict the memory card being inserted into thehost device/latch in a vertical orientation. In other embodiment, thememory card can be memory card being inserted into the host device/latchin other orientations, as per the host device.

Because different electronic devices use different types of memorycards, an adaptor is provided that allows the memory cards disclosedherein to be used in ports or connectors on electronic devices that aremeant for other types of memory cards (e.g. CompactFlash™, MMC™, SmartMedia, Secure Digital™, MiniSD, the Memory Stick, and others). That is,the adapter allows a memory of a first type (e.g. the memory cardsdescribed above) to communicate with a system expecting a memory of asecond type. In some implementations, the raised portion of the memorycard protrudes from the adaptor or can otherwise be accessed by a userwhen the card is properly inserted in the adaptor so that the user cangrab the raised portion and remove the memory card from the adapter.

While in the adaptor, the memory card can be inserted into a host deviceand data can be written to and read form the memory card. Similarly, thememory card can be inserted into a host device and data can be writtento and read form the memory card when the memory card is not in theadaptor.

FIGS. 28A-D show a memory card 902 (could be any of the memory cardsdescribed above) and an adapter 900. FIG. 28A depicts the front ofadaptor 900. FIG. 28B depicts a perspective view of the front of adaptor900. The adaptor can be used to allow memory card to work with a hostexpecting another format (any of the formats listed above, or otherformats). Adaptor has a slot 920 for inserting memory card 902. At theentrance of the slot, along the back surface of the adapter, is acircular opening that allows a user to grab the bottom of the memorycard. At the entrance of the slot, along the front surface of theadapter, is a rectangular opening that exposes raised portion 18 ofmemory card 902.

FIG. 28C depicts the back of adapter 900 and memory card 902. FIG. 28Cshows pins 910 on adapter 900 and pins 912 on memory card 902. Whenmemory card 902 is inserted into adapter 900, pins 912 of memory card902 engage connectors inside adapter 900. The connectors inside adapter900 are attached to wires (or other conductors). The wires connect tothe appropriate pins 910 of adapter 900. In some embodiment, adapter 900may include electronics, including logic, for converting between memoryformats. Note that adapters between memory formats are known in t heart. For example, see U.S. Pat. No. 6,381,662, which is incorporatedherein by reference in its entirety.

FIGS. 28A and 28B depict the memory 902 about to be (but not) insertedinto adapter 900. FIG. 28D shows memory card 902 inserted in adapter900. When memory card 902 is inserted in adapter 900, raised portion 18is exposed so that a user can grab raised portion with fingers or toolsand pull (or otherwise remove) memory card 902 from adapter 900. In oneembodiment, when card 902 is inserted in adapter 900, the top of raisedportion 18 is higher than the surface of the adapter so that isprotrudes from the adapter.

As described herein, the memory card can be manufactured and usedwithout a bottom lid or a top lid. Such a memory card can then beinserted into the adaptor, where the adaptor includes or serves as a toplid and/or bottom lid. That is the outside shell of the adaptor servesas the top lid and bottom lid (or a shell or an enclosure), so that thememory card has a top lid and bottom lid in a similar manner as othertypes of memory cards. The memory card is enclosed within the adapter,except for the exposed portion depicted in FIG. 28D. As described above,the memory card can be used (read and write data) while in the adaptorthat includes or serves as a top lid and/or bottom lid.

FIG. 29 is a flow chart describing one embodiment of a process for usinga memory card with an adapter. In step 940, a user inserts the memorycard into a slot in the adapter (e.g. slot 920). In step 942, the userpushed the memory card into a full insertion position so that the pins912 of memory card 902 engage connectors inside adapter 900. In step944, the user inserts the adapter (with the memory card) into a host orconnects the adapter to a host. In step 946, the user reads from and/orwrites to the memory car using the host, via the adapter. In step 948,the user removes (or disconnects) the adapter from the host. In step950, the user engages the raised portion 18 of the memory card and pullsthe memory card out of the adapter.

From box 950 to box 952 is a dashed line, which indicates that steps952-956 are an optional part of the process of FIG. 29. These steps areperformed when a user additionally uses the memory card without theadapter. The flow chart of FIG. 29 teaches that the same memory card canbe used with and without the adapter and, therefore, with and withoutthe top and bottom lids/enclosure/shell. In step 952, the user insertsthat same memory card into a host (same host or different host). In step954, the user reads from and/or writes to the memory car using the host.In step 956, the user removes the memory card from the host. Note thatstep 952 and 956 can be performed using the processes described abovewith respect to the push-push latch or using various methods known inthe art.

The foregoing detailed description of the invention has been presentedfor purposes of illustration and description. It is not intended to beexhaustive or to limit the invention to the precise form disclosed. Manymodifications and variations are possible in light of the aboveteaching. The described embodiments were chosen in order to best explainthe principles of the invention and its practical application to therebyenable others skilled in the art to best utilize the invention invarious embodiments and with various modifications as are suited to theparticular use contemplated. It is intended that the scope of theinvention be defined by the claims appended hereto.

1-8. (canceled)
 9. A method of using a non-volatile memory, comprising:inserting a removable memory card into an engaging position with respectto an adapter, said adapter has an input interface of a first type andan output interface of a second type, said removable memory card havinga raised portion along an outer surface of said removable memory card,said removable memory card includes a non-volatile storage device andsaid removable memory card includes a passive electrical elementenclosed within said removable memory card, said passive electricalelement is positioned in a part of said removable memory card at leastpartially defined by said raised portion; and accessing saidnon-volatile storage device from a host device via said adapter whilesaid removable memory card is in said engaging position with respect tosaid adapter.
 10. A method according to claim 9, further comprising:removing said removable memory card from said host device by holdingsaid removable memory card at said raised portion.
 11. A methodaccording to claim 9, further comprising: inserting said adapter into anengaging position with respect to said host device.
 12. A methodaccording to claim 9, further comprising: inserting said adapter into anengaging position with respect to said host device, said accessing isperformed after said inserting said adapter into an engaging positionwith respect to said host device; removing said adapter from said hostdevice after said accessing is performed; and removing said removablememory card from said adapter.
 13. A method according to claim 9,wherein: said accessing said non-volatile storage device from said hostdevice includes reading data from said non-volatile storage device. 14.A method according to claim 9, wherein: said accessing said non-volatilestorage device from a host device includes writing data to saidnon-volatile storage device.
 15. A method according to claim 9, wherein:said inserting a removable memory card into an engaging position withrespect to an adapter includes inserting said removable memory card intoa slot within said adapter so that pins on said removable memory cardengage a connection interface inside said adapter.
 16. A methodaccording to claim 9, wherein: said inserting a removable memory cardinto an engaging position with respect to an adapter includes insertingsaid removable memory card into said adapter so that said raisedportions protrudes from said adapter.
 17. A method according to claim 9,wherein: said inserting a removable memory card into an engagingposition with respect to an adapter includes inserting said removablememory card into said adapter so that said raised portions is accessiblevia an opening in an exterior surface of said adapter.
 18. A methodaccording to claim 9, wherein: said inserting a removable memory cardinto an engaging position with respect to an adapter includes insertingsaid removable memory card into said adapter so that said raisedportions is above an exterior surface of said adapter.
 19. Anon-volatile memory system, comprising: a removable card having a set ofcontacts on an external surface of said card, said card having a firstsurface and a second surface on an opposite side of said card from saidfirst surface, said first surface having a raised portion; anon-volatile storage device enclosed within said removable card; passiveelectrical elements enclosed within said removable card, said passiveelectrical elements are positioned in a part of said card at leastpartially defined by said raised portion; and an adapter, said adapterallows a card of a first type to connect to a receiver expecting a cardof a second type, said removable card is connected to said adapter viasaid contacts.
 20. A non-volatile memory system according to claim 19,wherein: said non-volatile storage device is a flash memory array.
 21. Anon-volatile memory system according to claim 19, wherein: said firstsurface defines a length and a width of said card.
 22. A non-volatilememory system according to claim 19, wherein: said raised portionprovides a grip to grab said card from said adapter.
 23. A non-volatilememory system according to claim 19, wherein: said removable cardincludes molding material encapsulating said non-volatile storage deviceand said passive electrical elements.
 24. A non-volatile memory systemaccording to claim 19, wherein: said removable card is inside saidadapter with said raised portion being exposed.
 25. A non-volatilememory system according to claim 19, wherein: said removable card isinside said adapter with said raised portion protruding from saidadapter.
 26. A non-volatile memory system according to claim 19,wherein: said adapter includes an exterior surface, said exteriorsurface does not cover said raised portion.
 27. A non-volatile memorysystem according to claim 19, wherein: said adapter includes an exteriorsurface, said exterior surface includes an opening for said raisedportion, said raised portions is above said exterior surface of saidadapter.
 28. A non-volatile memory system according to claim 19,wherein: said adapter includes an interior connection, exterior pins andconductors that connect said interior connection to said exterior pins;and said contacts of said removable card are connected to said interiorconnection of said adapter.
 29. A non-volatile memory system accordingto claim 19, wherein: said adapter includes electronics for convertingfrom a first format for said removable card to a second format for afirst type of host; said adapter is adapted to be connected to saidfirst type of host.
 30. A non-volatile memory system, comprising: aperipheral card having a length and a width, said card has a firstthickness along a first portion of said length and a second thicknessalong a second portion of said length, said second thickness is greaterthan said first thickness; a non-volatile storage device enclosed withinsaid peripheral card; passive electrical components enclosed within saidperipheral card, said passive electrical elements are positioned in saidsecond portion; and means for connecting said peripheral card to a hostthat is adapted to receive a card of a different format than saidperipheral card.
 31. A non-volatile memory system according to claim 29,wherein: said means for connecting includes means for allowing saidperipheral card to be removed from said means for connecting by engagingsaid second portion.